6" Bottom Side Heater Unit: EVG, For Use With EVG 501 or 520 Wafer Bonder Systems (O431-77)

Full Description

6" Bottom Side Heater Unit: EVG, For Use With EVG 501 or 520 Wafer Bonder Systems This equipment is found on EVG 501 and EVG 520 Wafer Bonder systems (with 6" platform only). This is a refurbished model by Class One, believed to be unused and in box. This equipment is being sold as-is, where-is, with no guarantees or warranties regarding its functionality or condition. Only items shown in photos are included with the equipment. LOCATION: This equipment is not located at the UW Surplus Warehouse. Location of this equipment is on the University of Washington Campus at Fluke Hall. CONTACT: For questions about this equipment, or to schedule a viewing appointment, the onsite contact for this equipment is Sarice Jones, sbjones@uw.edu. Contact may not be available on weekends and University holidays. PLEASE NOTE: UW Surplus is *not* set up to offer packing or shipping. The Buyer is solely responsible for all arrangements and labor related to packing, loading, and transporting the property. No assistance will be provided. Limited forklift assistance may be available. See the "Removal" section below for details. All third-party pick-ups need to be communicated to UW Surplus before the release of items. See concurrent auctions of related equipment here and here. Click the link below the UW Surplus logo below to see our other auction listings.